LMH6733

SNOSAW0D – JANUARY 2007 – REVISED MAY 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

ESD Tolerance (3)

Human Body Model

2000V

Machine Model

200V

Supply Voltage (V+ - V–)

13.2V

IOUT

(4)

Common Mode Input Voltage

±VCC

Maximum Junction Temperature

+150°C

Storage Temperature Range

−65°C to +150°C

Soldering Information

Infrared or Convection (20 sec.)

235°C

Wave Soldering (10 sec.)

260°C

Storage Temperature Range

−65°C to +150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical

Characteristics tables.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(4)

The maximum output current (IOUT) is determined by device power dissipation limitations. See the Power Dissipation section of the

Applications Information for more details.

Operating Ratings

(1)

Thermal Resistance

Package

(

θJC)

(

θJA)

16-Pin SSOP

36°C/W

120°C/W

Temperature Range (2)

−40°C

+85°C

Supply Voltage (V+ - V–)

3V

to

12V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical

Characteristics tables.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.

5V Electrical Characteristics

(1)

AV = +2, VCC = 5V, RL = 100Ω, RF = 340Ω; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Units

Frequency Domain Performance

UGBW

−3 dB Bandwidth

Unity Gain, VOUT = 200 mVPP

870

MHz

SSBW

−3 dB Bandwidth

VOUT = 200 mVPP, RL = 100Ω

650

SSBW

VOUT = 200 mVPP, RL = 150Ω

685

MHz

LSBW

VOUT = 2 VPP

480

0.1 dB

0.1 dB Gain Flatness

VOUT = 200 mVPP

320

MHz

BW

(1)

Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very

limited self-heating of the device such that TJ = TA. No specification of parametric performance is indicated in the electrical tables under

conditions of internal self-heating where TJ > TA.

2

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