SN65MLVD047APWR datasheet(5/26 Pages) TI2

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5.5 Thermal Information

PARAMETER

TEST CONDITIONS

VALUE

UNIT

θJA

Junction-to-ambient thermal resistance

Low-K board(1), no airflow

128

°C/W

Low-K board(1), no airflow

194.2

Low-K board(1), 150 LFM

146.8

Low-K board(1), 250 LFM

133.1

High-K board(2), no airflow

121.6

θJB

Junction-to-board thermal resistance

High-K board(2)

51.1

°C/W

85.3

θJC

Junction-to-case thermal resistance

45.4

°C/W

34.7

(1)

In accordance with the Low-K thermal metric definitions of EIA/JESD51-3.

(2)

In accordance with the High-K thermal metric definitions of EIA/JESD51-7.

5.6 Device Electrical Characteristics

over recommended operating conditions unless otherwise noted

PARAMETER

TEST CONDITIONS

MIN TYP(1)

MAX UNIT

ICC

Supply current

Driver enabled EN = VCC, EN = GND, RL = 50Ω, All inputs = VCC or GND

Driver disabled EN = GND, EN = VCC, RL = No load, All inputs = VCC or GND

(1)

All typical values are at 25°C and with a 3.3V supply voltage.

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SN65MLVD047A

SLLS736B – JULY 2006 – REVISED MARCH 2024

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