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TLV27L2CDGK Datasheet(PDF) 14 Page - Texas Instruments

Part # TLV27L2CDGK
Description  FAMILY OF MICROPOWER RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
PDF  26 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TLV27L2CDGK Datasheet(HTML) 14 Page - Texas Instruments

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PACKAGE MATERIALS INFORMATION
www.ti.com
23-May-2025
TAPE AND REEL INFORMATION
Reel Width (W1)
REEL DIMENSIONS
A0
B0
K0
W
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Dimension designed to accommodate the component width
TAPE DIMENSIONS
K0
P1
B0 W
A0
Cavity
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Pocket Quadrants
Sprocket Holes
Q1
Q1
Q2
Q2
Q3
Q3
Q4
Q4
User Direction of Feed
P1
Reel
Diameter
*All dimensions are nominal
Device
Package
Type
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TLV27L1CDBVR
SOT-23
DBV
5
3000
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TLV27L1CDBVR
SOT-23
DBV
5
3000
180.0
9.0
3.15
3.2
1.4
4.0
8.0
Q3
TLV27L1CDBVT
SOT-23
DBV
5
250
180.0
9.0
3.15
3.2
1.4
4.0
8.0
Q3
TLV27L1CDBVT
SOT-23
DBV
5
250
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TLV27L1IDBVR
SOT-23
DBV
5
3000
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TLV27L1IDBVR
SOT-23
DBV
5
3000
180.0
9.0
3.15
3.2
1.4
4.0
8.0
Q3
TLV27L1IDBVT
SOT-23
DBV
5
250
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TLV27L1IDBVT
SOT-23
DBV
5
250
180.0
9.0
3.15
3.2
1.4
4.0
8.0
Q3
TLV27L1IDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLV27L2CDGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
TLV27L2CDGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
TLV27L2CDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLV27L2IDGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
TLV27L2IDGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
TLV27L2IDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1



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