www.ti.com

REGULATORY INFORMATION

THERMAL CHARACTERISTICS

TYPICAL CHARACTERISTIC CURVES

0

5

10

15

20

25

30

35

0

25

50

75

100

125

150

SignalingRate-Mbps

40

45

T =25°C,

Load=15pF,

AllChannels

A

5-VI

CC2

3.3-VI

CC2

3.3-VI

CC1

5-VI

CC1

0

5

10

15

20

25

30

35

40

45

0

25

50

75

100

125

150

SignalingRate-Mbps

T =25°C,

Load=15pF,

AllChannels

A

5-VI

CC2

3.3-VI

CC2

3.3-VI

CC1

5-VI

CC1

ISO7240

ISO7241

ISO7242

SLLS868A – SEPTEMBER 2007 – REVISED DECEMBER 2007

VDE

CSA

UL

Recognized under 1577

Certified according to IEC

Approved under CSA Component

Component Recognition

60747-5-2

Acceptance Notice

File Number: Pending

File Number: Pending

File Number: E181974

(1)

Production tested

≥ 3000 Vrms for 1 second in accordance with UL 1577.

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

168

θ

JA

Junction-to-air

°C/W

High-K Thermal Resistance

96.1

θ

JB

Junction-to-Board Thermal Resistance

61

°C/W

θ

JC

Junction-to-Case Thermal Resistance

48

°C/W

Device Power Dissipation

220

mW

Input a 50% duty cycle square wave

(1)

Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.

ISO7240C/M RMS SUPPLY CURRENT

ISO7241C/M RMS SUPPLY CURRENT

vs

vs

SIGNALING RATE

SIGNALING RATE

Figure 6.

Figure 7.

16

Submit Documentation Feedback

Copyright © 2007, Texas Instruments Incorporated

Product Folder Link(s): ISO7240 ISO7241 ISO7242