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LM4871MMX/NOPB Datasheet(PDF) 14 Page - Texas Instruments

Part # LM4871MMX/NOPB
Description  LM4871 3W Audio Power Amplifier with Shutdown Mode
PDF  30 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

LM4871MMX/NOPB Datasheet(HTML) 14 Page - Texas Instruments

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LM4871
SNAS002F – FEBRUARY 2000 – REVISED MAY 2013
www.ti.com
Die/Wafer Characteristics
Fabrication Attributes
General Die Information
Physical Die Identification
LM4871C
Bond Pad Opening Size (min)
102µm x 102µm
Die Step
C
Bond Pad Metalization
0.5% COPPER_BAL.
ALUMINUM
Physical Attributes
Passivation
NITRIDE
Wafer Diameter
150mm
Back Side Metal
BARE BACK
Dise Size (Drawn)
1372µm x 1758µm
Back Side Connection
GND
54mils x 69mils
Thickness
406µm Nominal
Min Pitch
164µm Nominal
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
Die Bond Pad Coordinate Locations (C - Step)
(Referenced to die center, coordinates in µm) NC = No Connection
X/Y COORDINATES
PAD SIZE
SIGNAL NAME
PAD# NUMBER
X
Y
X
Y
SHUTDOWN
1
-559
541
102
x
102
BYPASS
2
-559
376
102
x
102
NC
3
-559
-45
102
x
210
INPUT +
4
-559
-248
102
x
102
INPUT -
5
-559
-486
102
x
102
GND
6
-476
-725
102
x
102
VOUT 1
7
-135
-598
102
x
210
GND
8
554
-686
102
x
102
VDD
9
554
-4
102
x
210
GND
10
554
568
102
x
102
VOUT 2
11
-135
598
102
x
210
GND
12
-473
752
102
x
102
14
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Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM4871



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