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HS2-117RH/PROTO Datasheet(PDF) 13 Page - Renesas Technology Corp |
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HS2-117RH/PROTO Datasheet(HTML) 13 Page - Renesas Technology Corp |
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13 / 16 page ![]() HS-117RH, HS-117EH FN4560 Rev.11.01 Page 13 of 15 Aug 12, 2025 Package Outline Drawings E Top View D Side View Bottom View A A 0.004 C (3 Places) C A1 b b1 D1 b3 (2 Places) b2 (2 Places) (2 Places) e 0.014 M CA B J3.A 3 Pad Hermetic SMD.5 Package Bottom Terminal Ceramic Leadless Chip Carrier (CLCC) Symbol Inches Millimeters Notes Min Max Min Max A 0.112 0.122 2.84 3.10 3 A1 0.010 0.020 0.25 0.51 - b 0.281 0.291 7.13 7.39 - b1 0.220 0.230 5.58 5.84 - b2 0.090 0.100 2.28 2.54 - b3 0.115 0.125 2.92 3.18 - D 0.395 0.405 10.03 10.28 - D1 0.030 - 0.76 - - E 0.291 0.301 7.39 7.64 - e 0.075 BSC 1.91 BSC - Rev. 6 8/2025 Notes: 1. Controlling dimensions are in inches (mm for reference only). 2. Dimensioning and tolerance per ANSI Y14.5M - 1982. 3. The maximum “A” dimension is package height before being solder dipped. 4. Patterned after MIL-STD-1835 CBCC1-N3 (C-B1). For the most recent package outline drawing, see J3.A. |
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