CC2640R2FYFVT.B datasheet(42/74 Pages) TI2

42 / 74 page

9.11 Voltage Supply Domains

The CC2640R2F device can interface to two or three different voltage domains depending on the package type.

On-chip level converters ensure correct operation as long as the signal voltage on each input/output pin is set

with respect to the corresponding supply pin (VDDS, VDDS2 or VDDS3). Table 9-3 lists the pin-to-VDDS

mapping.

Table 9-3. Pin Function to VDDS Mapping Table

Package

VQFN 7 × 7 (RGZ)

VQFN 5 × 5 (RHB)

VQFN 4 × 4

(RSM)

DSBGA (YFV)

VDDS(1)

DIO 23–30

Reset_N

DIO 7–14

Reset_N

DIO 5–9

Reset_N

DIO 7–13

Reset_N

VDDS2

DIO 0–11

DIO 0–6

JTAG

DIO 0–4

JTAG

DIO 0–6

JTAG

VDDS3

DIO 12–22

JTAG

N/A

(1)

VDDS_DCDC must be connected to VDDS on the PCB.

9.12 System Architecture

Depending on the product configuration, CC26xx can function either as a Wireless Network Processor (WNP—

an IC running the wireless protocol stack, with the application running on a separate MCU), or as a System-on-

Chip (SoC), with the application and protocol stack running on the Arm® Cortex®-M3 core inside the device.

In the first case, the external host MCU communicates with the device using SPI or UART. In the second case,

the application must be written according to the application framework supplied with the wireless protocol stack.

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

www.ti.com

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