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L9680 Datasheet(PDF) 258 Page - STMicroelectronics |
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L9680 Datasheet(HTML) 258 Page - STMicroelectronics |
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258 / 286 page  Electrical characteristics L9680 258/286 DS11615 Rev 7 Figure 73. Deployment drivers diagram GAPGPS01153 ESD/EMI Protection Squib EMI Protection Squib Load R_Squib L_EMI L_CS1 R_CS1 L_CS2 R_CS2 Clock Spring Impedance System Wiring Impedance R_Wire 1 Wire Lenght (m) kL_CS1 - L_CS2 L_Wire 1 R_Wire 2 L_Wire 2 C_SFx SFx SRx C_SRx Table 57. Deployment drivers – AC specifications No Symbol Parameter Conditions Min Typ Max Unit 1 TDEPL Deployment time DCR_x(Dep_Current) = IDEPL_LO ≥1.209A rising to 1.209A falling; TDEPL = DCR_x(Deploy_Time)* TDEP_TIME_RES - TDEL_IDEP - DCR_ x(Depl oy_Ti me)* TDEP _TIM E_RE S - 65 - - DCR _x(D eploy _Tim e)* TDEP _TIME _RES - ms 2 3 4 TDEP_TIME_RES DCR_x Deploy_Time resolution - - - µs 5 TDEP_CC_RES Deployment current counter resolution - - - µs 6 TRISE_IDEPL Rise time 10% - 90% of IDEPL SSxy = 25 V, RSQ = 2.2 ohm, C = 22 nF L = 44 µH - - 32 µs 7 TDEL_IDEP Delay time SPI_CS to 90% IDEPL - - 65 µs 8 TFALL_IDEPL Fall time 90% - 10% IDEPL - - 32 µs 9 TDEL_SD_LS Low-side shutdown delay time (with respect to high-side deactivation) - 50 - - µs 1024 fosc ------------- 256 fosc ---------- |
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