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VN5E010AH Datasheet(PDF) 28 Page - STMicroelectronics |
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VN5E010AH Datasheet(HTML) 28 Page - STMicroelectronics |
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28 / 37 page ![]() Package and PC board thermal data VN5E010AH 28/37 Doc ID 15984 Rev 3 4 Package and PC board thermal data 4.1 HPAK thermal data Figure 35. PC board(1) 1. Layout condition of Rth and Zth measurements (PCB FR4 area = 58 mm x 58 mm, PCB thickness =1.8 mm, Cu thickness = 70 µm, Copper areas: from minimum pad lay-out to 8 cm2). Figure 36. Rthj-amb vs. PCB copper area in open box free air condition 30 35 40 45 50 55 60 65 70 02 46 8 10 RTHj_amb(°C/W) PCB Cu heatsink area (cm^2) |
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