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L99PM72PXP Datasheet(PDF) 50 Page - STMicroelectronics

Part # L99PM72PXP
Description  Advanced power management system IC with embedded LIN and high speed CAN transceiver supporting CAN Partial Networking
PDF  128 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

L99PM72PXP Datasheet(HTML) 50 Page - STMicroelectronics

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Electrical specifications
L99PM72PXP
50/128
Doc ID 023553 Rev 3
5.2
ESD protection
5.3
Thermal data
Table 10.
ESD protection
Parameter
Value
Unit
All pins (1)
1.
HBM (Human Body Model, C = 100 pF, R = 1.5 k
) according to MIL 883C, Method 3015.7 or
EIA/JESD22A114-A.
+/-2
kV
All output pins(2)
2.
HBM with all none zapped pins grounded.
+/-4
kV
LIN
+/-8 (2)
+/-10 (3)
+/-6 (4)
3.
Indirect ESD test according to IEC 61000-4-2 (C = 150 pF, R = 330
) and ‘Hardware Requirements for
LIN, CAN and Flexray Interfaces in Automotive Applications’ (version 1.1, 2009-12-02).
4.
Direct ESD test according to IEC 61000-4-2 (C = 150pF, R = 330
) and ‘Hardware Requirements for LIN,
CAN and Flexray Interfaces in Automotive Applications’ (version 1.1, 2009-12-02).
kV
CAN_H, CAN_L
+/-8 (2)
+/-6 (4)
kV
All pins (5)
5.
Charged device model.
+/-500
V
Corner pins (5)
+/-750
V
All pins (6)
6.
Machine model: C = 200 pF; R = 0
+/-200
V
Table 11.
Operating junction temperature
Symbol
Parameter
Value
Unit
Tj
Operating junction temperature
-40 to 150
°C
Rthj_amb
Thermal resistance junction ambient
See Figure 29
K/W
Table 12.
Temperature warning and thermal shutdown
Symbol
Parameter
Min.
Typ.
Max.
Unit
TW_ON
Thermal over temperature
warning threshold
Tj
(1)
1.
Non-overlapping.
120
130
140
°C
TSD1_OFF
Thermal shut-down junction
temperature 1
Tj
(1)
130
140
150
°C
TSD2_OFF
Thermal shut-down junction
temperature 2
Tj
(1)
150
160
170
°C
TSD12_hys
Hysteresis
5
°C



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