Package and PCB thermal data

VNH5050A-E

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Doc ID 16009 Rev 11

4

Package and PCB thermal data

4.1

PowerSSO-36 thermal data

Figure 15.

PowerSSO-36™ PC board

Note:

Board finish thickness 1.6 mm +/- 10%, Board double layers and four layers, Board

dimension 129x60, Board Material FR4, Cu thickness 0.070mm (front and back side),

Thermal vias spaced on a 1.2 mm x 1.2 mm grid, Vias pad clearance thickness 0.2 mm,

Thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 0.025 mm, Footprint

dimension 4.1 mm x 6.5 mm.

Double layers: footprint

Double layers: 2cm2 of Cu

Double layers: 8cm2 of Cu

Four layers: Cu on top layer: 16 cm2; Cu on bottom layer: 32 cm2; Cu on middle layer: total coverage