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LM5166DRCRG4 Datasheet(PDF) 46 Page - Texas Instruments |
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LM5166DRCRG4 Datasheet(HTML) 46 Page - Texas Instruments |
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46 / 57 page  LF CIN COUT Vias to Type 3 Ripple Generation Network (Optional) RESR RFB2 RFB1 CFF CB RILIM CSS RRT VIN connection GND connection VOUT connection Place ceramic input cap close to VIN and GND Place SS cap close to pin Thermal vias under LM5166 PAD Place FB resistors very close to FB & GND pins 46 LM5166 SNVSA67B – DECEMBER 2016 – REVISED JUNE 2017 www.ti.com Product Folder Links: LM5166 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated 10.2 Layout Example Figure 90 shows an example layout for the PCB top layer of a 4-layer board with essential components placed on the top side. The bottom layer features optional Type 3 ripple generation components (RA and CA), and RUV1, RUV2, and RHYS resistors. Figure 90. LM5166 Single-Sided PCB Layout Example |
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