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STM32L443CC Datasheet(PDF) 202 Page - STMicroelectronics |
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STM32L443CC Datasheet(HTML) 202 Page - STMicroelectronics |
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202 / 215 page ![]() Package information STM32L443CC STM32L443RC STM32L443VC 202/215 DS11421 Rev 4 Device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 59. WLCSP49 marking (package top view) 1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. Table 101. WLCSP49 recommended PCB design rules (0.4 mm pitch) Dimension Recommended values Pitch 0.4 Dpad 0.225 mm Dsm 0.290 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm |
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