LMV7271, LMV7272, LMV7275

SNOSA56I – FEBRUARY 2003 – REVISED SEPTEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

±Supply

VIN Differential

V

Voltage

Supply Voltage (V+ - V−)

6

V

Voltage at Input/Output pins

(V+) + 0.1

(V−)

− 0.1

V

Junction Temperature(3)

150

°C

Storage Temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for availability and

specifications.

(3)

The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) - TA)/RθJA. All numbers apply for packages soldered directly into a PCB.

6.2 ESD Ratings

VALUE

UNIT

SOT-23, SC70 PACKAGE

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2)

±2000

V(ESD)

Electrostatic discharge

V

Machine Model (MM)(3)

±200

DSBGA PACKAGE

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2)

±2000

V(ESD)

Electrostatic discharge

V

Machine Model (MM)(3)

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

Human body model, 1.5 k

Ω in series with 100 pF.

(3)

Machine Model, 0

Ω in series with 200 pF.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

Supply Voltage

1.8

5.5

V

Temperature(1)

–40

85

°C

(1)

The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) - TA)/RθJA. All numbers apply for packages soldered directly into a PCB.

6.4 Thermal Information

LMV7271, LMV7275

LMV7272

THERMAL METRIC(1)

DBV (SOT-23)

DGK (SC70)

YZR (DSBGA)

UNIT

5 PINS

5 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance(2)

325

265

220

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) - TA)/RθJA. All numbers apply for packages soldered directly into a PCB.

4

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