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LP55231 Datasheet(PDF) 2 Page - Texas Instruments

Part # LP55231
Description  LP55231 Nine-Channel RGB, White-LED Driver With Internal Program Memory and Integrated Charge Pump - WQFN
PDF  59 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

LP55231 Datasheet(HTML) 2 Page - Texas Instruments

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LP55231
SNOSCR5D – MARCH 2013 – REVISED DECEMBER 2016
www.ti.com
Product Folder Links: LP55231
Submit Documentation Feedback
Copyright © 2013–2016, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Pin Configuration and Functions ......................... 3
6
Specifications......................................................... 4
6.1
Absolute Maximum Ratings ...................................... 4
6.2
ESD Ratings.............................................................. 4
6.3
Recommended Operating Conditions ....................... 4
6.4
Thermal Information .................................................. 4
6.5
Electrical Characteristics........................................... 5
6.6
Charge Pump Electrical Characteristics ................... 5
6.7
LED Driver Electrical Characteristics ........................ 6
6.8
LED Test Electrical Characteristics........................... 6
6.9
Logic Interface Characteristics.................................. 6
6.10
Recommended External Clock Source Conditions . 7
6.11
Serial Bus Timing Parameters (SDA, SCL) ............ 7
6.12
Typical Characteristics ............................................ 8
7
Detailed Description ............................................ 10
7.1
Overview ................................................................. 10
7.2
Functional Block Diagram ....................................... 10
7.3
Feature Description................................................. 11
7.4
Device Functional Modes........................................ 17
7.5
Programming........................................................... 18
7.6
Register Maps ......................................................... 20
8
Application and Implementation ........................ 46
8.1
Application Information............................................ 46
8.2
Typical Applications ................................................ 46
9
Power Supply Recommendations ...................... 50
10
Layout................................................................... 50
10.1
Layout Guidelines ................................................. 50
10.2
Layout Example .................................................... 50
11
Device and Documentation Support ................. 51
11.1
Device Support...................................................... 51
11.2
Trademarks ........................................................... 51
11.3
Receiving Notification of Documentation Updates 51
11.4
Community Resources.......................................... 51
11.5
Electrostatic Discharge Caution ............................ 51
11.6
Glossary ................................................................ 51
12
Mechanical, Packaging, and Orderable
Information ........................................................... 51
4 Revision History
Changes from Revision C (November 2016) to Revision D
Page
•
Added top nav icon for TI Designs ........................................................................................................................................ 1
•
Changed variable 1 spanning to go from Bit [3] to Bit [2] and variable 2 span from Bit [1] to Bit [0] in table 7 .................. 39
Changes from Revision B (May 2016) to Revision C
Page
•
Changed wording of data sheet title....................................................................................................................................... 1
Changes from Revision A (October 2014) to Revision B
Page
•
Added several new Applications ............................................................................................................................................ 1
•
Changed Handling Ratings to ESD Ratings; moved storage temperature to Abs Max table ............................................... 4
•
Changed RθJA value from 36.6C/W to 33.3C/W; add additional thermal information ............................................................. 4
•
Added Community Resources section ................................................................................................................................ 51
Changes from Original (March 2013) to Revision A
Page
•
Added Device Information and Handling Rating tables, Feature Description, Device Functional Modes, Application
and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and
Mechanical, Packaging, and Orderable Information sections; moved some curves to Application Curves section ............. 1



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