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SN74LVC1G57

SCES414P – NOVEMBER 2002 – REVISED NOVEMBER 2016

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Copyright © 2002–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information .................................................. 5

6.5

Electrical Characteristics........................................... 5

6.6

Switching Characteristics .......................................... 6

6.7

Typical Characteristics .............................................. 6

7

Parameter Measurement Information .................. 7

8

Detailed Description .............................................. 8

8.1

Overview ................................................................... 8

8.2

Functional Block Diagram ......................................... 8

8.3

Feature Description................................................... 8

8.4

Device Functional Modes.......................................... 8

9

Application and Implementation ........................ 10

9.1

Application Information............................................ 10

9.2

Typical Application .................................................. 10

10

Power Supply Recommendations ..................... 12

11

Layout................................................................... 12

11.1

Layout Guidelines ................................................. 12

11.2

Layout Example .................................................... 12

12

Device and Documentation Support ................. 13

12.1

Documentation Support ........................................ 13

12.2

Receiving Notification of Documentation Updates 13

12.3

Community Resources.......................................... 13

12.4

Trademarks ........................................................... 13

12.5

Electrostatic Discharge Caution ............................ 13

12.6

Glossary ................................................................ 13

13

Mechanical, Packaging, and Orderable

Information ........................................................... 13

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision O (December 2013) to Revision P

Page

•

Added Applications section, Device Information table, ESD Ratings table, Thermal Information table, Feature

Description section, Device Functional Modes, Application and Implementation section, Power Supply

Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,

Packaging, and Orderable Information section ...................................................................................................................... 1

•

Changed Package thermal impedance, RθJA, values From: 165°C/W To: 223°C/W (DBV), From: 259°C/W To:

271.7°C/W (DCK), From: 142°C/W To: 252.5°C/W (DRL), and From: 123°C/W To: 124°C/W (YZP)................................... 5

Changes from Revision N (April 2013) to Revision O

Page

•

Changed Ioff in Features ......................................................................................................................................................... 1

•

Changed Operating temperature range.................................................................................................................................. 4

Changes from Revision M (October 2011) to Revision N

Page

•

Removed Ordering Information table; package updates now included in Package Ordering Addendum ............................. 1

Changes from Revision L (January 2007) to Revision M

Page

•

Added additional package options to the Ordering Information table .................................................................................... 1

•

Added DRY and DSF packages to data sheet ....................................................................................................................... 1