SM6F13AY datasheet(5/15 Pages) STMICROELECTRONICS

5 / 15 page

Figure 7. Junction capacitance versus reverse applied

voltage (unidirectional types)

0.1

100

C (nF)

VR(V)

SM6F5.0AY

SM6F20AY

SM6F33AY

f = 1 MHz

Vosc = 30 mVRMS

Tj = 25 °C

Figure 8. Leakage current versus junction temperature

100

1000

10000

100

125

150

175

IR (nA)

Tj (°C)

VR =VRM

VRM ≥ 10V

VRM < 10V

Figure 9. Peak forward voltage drop versus peak forward

current

0.01

0.1

100

0.2

0.4

0.6

0.8

1.2

1.4

1.6

IF (A)

VF (V)

single pulse

Tj = 25 °C

Tj = 175 °C

Figure 10. Thermal impedance junction to ambient versus

pulse duration

100

1000

0.01

0.1

100

1000

th(j-a) (°C/W)

tp (s)

Single pulse on recommended footprint.

Epoxy printed circuit board FR4, 70 µm Cu thickness

Figure 11. Thermal resistance junction to ambient versus

copper area under each lead (SOD128 Flat)

120

150

0.5

1.5

2.5

3.5

4.5

Rth(j-a) (°C/W)

SCu (cm²)

Single pulse on recommended footprint.

Epoxy printed circuit board FR4, 70 µm Cu thickness

Figure 12. ISO7637-2 pulse 1: Vs = -150 V with 12 V

battery

SM6FxxAY

Characteristics (curves)

DS13062 - Rev 2

page 5/15

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