7.3 Thermal Information

THERMAL METRIC(1)

TMUX7411F/ TMUX7412F/

TMUX7413F

UNIT

PW (TSSOP)

RRP (WQFN)

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

TBD

42.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

TBD

28.5

°C/W

RθJB

Junction-to-board thermal resistance

TBD

17.9

°C/W

ΨJT

Junction-to-top characterization parameter

TBD

0.3

°C/W

ΨJB

Junction-to-board characterization parameter

TBD

17.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

4.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX UNIT

VDD – VSS (1)

Power supply voltage differential

8

44

V

VDD

Positive power supply voltage

5

44

VS

Source pin (Sx) voltage (non-fault condition)

VSS

VDD

V

VS to GND

Source pin (Sx) voltage to GND (fault condition)

–60

60

VS to VDD (2)

Source pin (Sx) voltage to VDD or VD (fault condition)

–85

VS to VSS (2)

Source pin (Sx) voltage to VSS or VD (fault condition)

85

VD

Drain pin (Dx) voltage

VSS

VDD

VSEL

Logic control input pin voltage (SELx)

GND

44

V

VFF (3)

Logic output pin voltage (FF)

GND

5.5

TA

Ambient temperature

–40

125

°C

IDC

Continuous current through switch, WQFN package

TA = 25°C

150

mA

TA = 85°C

100

TA = 125°C

60

(1)

VDD and VSS can be any value as long as 8 V ≤ (VDD – VSS) ≤ 44 V, and the minimum VDD is met.

(2)

Source pin voltage (Sx) under a fault condition may not exceed 85 V from supply pins (VDD and VSS.) or drain pins (D, Dx).

(3)

Logic output pin (FF) is an open drain output and should be pulled up to a voltage within the max ratings

www.ti.com

TMUX7411F, TMUX7412F, TMUX7413F

SCDS404B – MARCH 2021 – REVISED NOVEMBER 2022

Copyright © 2022 Texas Instruments Incorporated

Submit Document Feedback

5

Product Folder Links: TMUX7411F TMUX7412F TMUX7413F