7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VDD to VSS

Supply voltage

48

V

VDD to GND

–0.3

48

V

VSS to GND

–48

0.3

V

VS to GND

Source input pin (Sx) voltage to GND

–65

65

V

VS to VDD

Source input pin (Sx) voltage to VDD

–90

V

VS to VSS

Source input pin (Sx) voltage to VSS

90

V

VD

Drain pin (Dx) voltage

VSS–0.7

VDD+0.7

V

VSEL

Logic control input pin voltage (SELx)(2)

GND –0.7

48

V

VFF

Logic output pin voltage (FF)(2)

GND –0.7

6

V

ISEL

Logic control input pin current (SELx)(2)

–30

30

mA

IFF

Logic output pin current (FF)(2)

–10

10

mA

IS or ID (CONT)

Source or drain continuous current (Sx or Dx)

IDC ± 10 %(3)

IDC ± 10 %(3)

mA

Tstg

Storage temperature

–65

150

°C

TA

Ambient temperature

–55

150

°C

TJ

Junction temperature

150

°C

Ptot (4)

Total power dissipation (QFN)

1600

mW

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not

sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,

performance, and shorten the device lifetime.

(2)

Stresses have to be kept at or below both voltage and current ratings at all time.

(3)

Refer to Recommended Operating Conditions for IDC ratings.

(4)

For QFN package: Ptot derates linearly above TA = 70°C by 23.5 mW/°C

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±6000

V

Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all

pins(2)

±750

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

TMUX7411F, TMUX7412F, TMUX7413F

SCDS404B – MARCH 2021 – REVISED NOVEMBER 2022

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