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TPA3121D2PWPR.B Datasheet(PDF) 33 Page - Texas Instruments |
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TPA3121D2PWPR.B Datasheet(HTML) 33 Page - Texas Instruments |
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33 / 34 page ![]() www.ti.com EXAMPLE STENCIL DESIGN 24X (1.5) 24X (0.45) (2.4) (5.16) BASED ON 0.125 THICK STENCIL 22X (0.65) (R ) TYP 0.05 (5.8) 4222709/A 02/2016 PowerPAD TSSOP - 1.2 mm max height PWP0024B PLASTIC SMALL OUTLINE 2.03 X 4.36 0.175 2.19 X 4.71 0.15 2.4 X 5.16 (SHOWN) 0.125 2.68 X 5.77 0.1 SOLDER STENCIL OPENING STENCIL THICKNESS NOTES: (continued) 10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 11. Board assembly site may have different recommendations for stencil design. TM SYMM SYMM 1 12 13 24 BASED ON 0.125 THICK STENCIL BY SOLDER MASK METAL COVERED SEE TABLE FOR DIFFERENT OPENINGS FOR OTHER STENCIL THICKNESSES SOLDER PASTE EXAMPLE EXPOSED PAD 100% PRINTED SOLDER COVERAGE BY AREA SCALE:10X |
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