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STTH2003CG Datasheet(PDF) 5 Page - STMicroelectronics |
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STTH2003CG Datasheet(HTML) 5 Page - STMicroelectronics |
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5 / 16 page ![]() Figure 11. Thermal resistance, junction to ambient, versus copper surface under tab (epoxy printed board FR4, eCu = 35µm) (D²PAK) 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 SCu(cm²) Figure 12. Average forward current versus ambient temperature (δ = 0.5, per diode) 0 1 2 3 4 5 6 7 8 9 10 11 12 0 25 50 75 100 125 150 175 I (A) F(AV) T (°C) amb R = R th(j-a) th(j-c) TO-220AB / I²PAK / D²PAK TO-220FPAB STTH2003 Characteristics (curves) DS1213 - Rev 12 page 5/16 |
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