P2TC

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Vishay Sfernice

Revision: 13-Nov-2020

4

Document Number: 53080

For technical questions, contact: sferthinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PACKAGING

ESD packaging available: waffle-pack, and plastic tape and reel (low conductivity).

PACKAGING RULES

Waffle Pack

Can be filled up to maximum quantity indicated in the table here above, taking into account the minimum order quantity. When

quantity ordered exceeds maximum quantity of a single waffle pack, the waffle packs are stacked up on the top of each other

and closed by one single cover.

To get “not stacked up” waffle pack in case of ordered quantity > maximum number of pieces per package: Please

consult Vishay Sfernice for specific ordering code.

Tape and Reel

See Part Numbering information to get the quantity desired by tape.

SIZE

MOQ

NUMBER OF PIECES PER PACKAGE

TAPE

WIDTH

WAFFLE PACK

2" × 2"

TAPE AND REEL

MIN.

MAX.

0402

100

340

100

5000

8 mm

0603

100

0805

4000

1206

140

2010

60

1000

PERFORMANCE

TESTS

CONDITIONS

MIL OR CECC

REQUIREMENTS

TYPICAL

PERFORMANCES

Thermal shock

MIL-PRF-55342G

MIL-STD-202 F-Method 107 F

± 0.05 %

± 0.02 %

Short time overload

MIL-PRF-55342G

PARA 3.10.4.7.5

± 0.05 %

± 0.01 %

Low temperature operation

MIL-PRF-55342G

PARA 3.9 and 4.7.4

± 0.05 %

± 0.01 %

Resistance to solder heat

MIL-PRF-55342G

PARA 3.12, 4.7.7, 4.7.1.2

± 0.05 %

± 0.03 %

Moisture resistance

MIL-PRF-55342G

PARA 3.13 and 4.7.8

MIL-STD-202 F-Method 106 E

± 0.10 %

± 0.01 %

CECC 56 days / 40 °C / 93 % RH

± 0.10 %

± 0.01 %

High temperature

MIL-PRF-55342G

PARA 3.11 and 4.7.6

± 0.05 %

± 0.05 %

Load life

MIL-PRF-55342G

8000 h Pn at 70 °C

MIL-STD-202 F-Method 108 A

± 0.5 %

± 0.1 % (2)