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VD6725SW Datasheet(PDF) 1 Page - STMicroelectronics

Part # VD6725SW
Description  2 megapixel, 1/5 inch system-on-chip imaging sensor
PDF  4 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

VD6725SW Datasheet(HTML) 1 Page - STMicroelectronics

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Data Brief
For further information contact your local STMicroelectronics sales office.
January 2008
Rev 2
1/4
4
VD6725
2 megapixel, 1/5 inch system-on-chip imaging sensor
Features
UXGA (2 megapixel) sensor array
1/5” optical format, 1.75 µm pixel size
SNR max > 36 dB
10-bit continuous-time single-end ADC
Selectable 8-bit parallel or CSI2 serial output
Integrated high-performance image signal
processor and camera controller
– 4-channel radial anti-vignetting
– dynamic singlet/couplet correction
– adaptive noise reduction
– high-quality scaler: any size scaling down
from SXGA
– electronic zoom
15 frames per second (fps) at full resolution,
30 fps in VGA with fast context switching
feature for quicker still image capture
Programmable I2C chip address
Low power consumption and ultra-low standby
current
1 Kbit OTP memory fully available to user
Integrated 1.2 V regulator
TSV wafer level package option
Benefits
Compatible with camera modules with Z height
below 4 mm
Compatible with camera modules < 6 x 6 mm
2
Flexible applications (//ITU, MIPI) using the
same die
Creative special effects
Qualified for reflowable camera modules
Applications
Mobile phones
PDAs
PC cameras and peripherals
Gaming platforms
Description
VD6725 is an ultra-small, ultra-competitive and
ultra-smart 2 megapixel 1/5” SOC imaging sensor
with a high-performance image signal processor.
VD6725 imaging sensor allows design of ultra-low
height camera modules, thanks to ST’s pixel ultra-
low optical stack height that provides high
quantum efficiency, better light sensitivity and
improved relative illumination.
This cost competitive solution resulting from an
ultra-small sensor die size is based on ST’s
innovative sensor architecture and ST’s latest
imaging patents, combined to our new imaging
process.
ST’s new high performance imaging process
provides 1.75 µm pixel size, very high logic
density, excellent SNR and low light performance.
It is qualified in our 8” and 12” world-leading
manufacturing infrastructures.
www.st.com


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