M27V401 datasheet(6/15 Pages) STMICROELECTRONICS

6 / 15 page

M27V401

6/15

Figure 5. Read Mode AC Waveforms

AI00724B

tAXQX

tEHQZ

A0-A18

Q0-Q7

tAVQV

tGHQZ

tGLQV

tELQV

VALID

Hi-Z

VALID

Table 8B. Read Mode DC Characteristics (1)

(TA =0 to 70°C or –40 to 85°C; VCC = 3.3V ± 10%; VPP =VCC

Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.

2. Sampled only, not 100% tested.

Symbol

Alt

Parameter

Test Condition

M27V401

Unit

-180

-200

Min

Max

Min

Max

tAVQV

tACC

Address Valid to Output Valid

E=VIL,G= VIL

180

200

tELQV

tCE

Chip Enable Low to Output Valid

G= VIL

180

200

tGLQV

tOE

Output Enable Low to Output Valid

E = VIL

100

tEHQZ

(2)

tDF

Chip Enable High to Output Hi-Z

G= VIL

tGHQZ

(2)

tDF

Output Enable High to Output Hi-Z

E=VIL

tAXQX

tOH

Address Transition to Output

Transition

E=VIL,G= VIL

System Considerations

The power switching characteristics of Advanced

CMOS EPROMs require careful decoupling of the

devices. The supply current, ICC, has three seg-

ments that are of interest to the system designer:

the standby current level, the active current level,

and transient current peaks that are produced by

the falling and rising edges of E. The magnitude of

the transient current peaks is dependent on the

capacitive and inductive loading of the device at

the output.

The associated transient voltage peaks can be

suppressed by complying with the two line output

control and by properly selected decoupling ca-

pacitors. It is recommended that a 0.1

µF ceramic

capacitor be used on every device between VCC

and VSS. This should be a high frequency capaci-

tor of low inherent inductance and should be

placed as close to the device as possible. In addi-

tion, a 4.7

µF bulk electrolytic capacitor should be

used between VCC and VSS for every eight devic-

es. The bulk capacitor should be located near the

power supply connection point. The purpose of the

bulk capacitor is to overcome the voltage drop

caused by the inductive effects of PCB traces.

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