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AP60H06NF2 Datasheet(PDF) 2 Page - A POWER MICROELECTRONICS |
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AP60H06NF2 Datasheet(HTML) 2 Page - A POWER MICROELECTRONICS |
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2 / 7 page ![]() AP60H06NF2 65V N-Channel Enhancement Mode MOSFET AP60H06NF2 REV1.0 永源微電子科技有限公司 Electrical Characteristics (TJ=25℃, unless otherwise noted) Symbol Parameter Test Conditions Min. Typ. Max. Unit V(BR)DSS Drain-Source Breakdown Voltage VGS=0V, ID=250µA 65 72 - V lGSS Gate-body Leakage Current VDS=0V, VGS=±20V - - ±100 nA IDSS TJ=25°C Zero Gate Voltage Drain Current VDS=65V, VGS=0V 1 μA IDSS TJ=100°C 100 VGS(th) Gate-Threshold Voltage VDS=VGS, ID=250µA 1.2 1.7 2.5 V RDS(on) Drain-Source On-Resistance4 VGS=10V, ID=20A - 7.5 9.0 mΩ RDS(on) Drain-Source On-Resistance4 VGS=4.5V, ID=10A 11 13 mΩ gfs Forward Transconductance4 VDS = 10V, ID = 10A - 45 - S Ciss Input Capacitance VDS=30V, VGS=0V, f =1MHz - 1210 - pF Coss Output Capacitance - 343 - Crss Reverse Transfer Capacitance - 17 - Rg Gate Resistance f=1MHz - 1.5 - Ω Qg Total Gate Charge VGS=10V, VDS=30V, ID= 10A - 21.7 - nC Qgs Gate-Source Charge - 3.9 - Qgd Gate-Drain Charge - 4.5 - td(on) Turn-On Delay Time VGS=10V, VDD=30V, RG= 3Ω, ID=10A - 7.3 - ns tr Rise Time - 8.5 - td(off) Turn-Off Delay Time - 19.6 - tf Fall Time - 5.6 - trr Body Diode Reverse Recovery Time IF=10A, dl/dt=100A/μs - 34 - ns Qrr Body Diode Reverse Recovery Charge - 17 - nC VSD Diode Forward Voltage4 IS=10A, VGS = 0V - - 1.2 V IS Continuous Source Current TA=25°C - - 65 A Note 1、The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper. 2、The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2% 3、The EAS data shows Max. rating . The test condition is VDD=25V,VGS=10V,L=0.1mH,IAS=38A 4、The power dissipation is limited by 150 ℃ junction temperature 5、The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation |
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