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AP60H06NF2 Datasheet(PDF) 2 Page - A POWER MICROELECTRONICS

Part # AP60H06NF2
Description  65V N-Channel Enhancement Mode MOSFET
PDF  7 Pages
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Manufacturer  APME [A POWER MICROELECTRONICS]
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AP60H06NF2 Datasheet(HTML) 2 Page - A POWER MICROELECTRONICS

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AP60H06NF2
65V N-Channel Enhancement Mode MOSFET
AP60H06NF2 REV1.0
永源微電子科技有限公司
Electrical Characteristics (TJ=25℃, unless otherwise noted)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V(BR)DSS
Drain-Source Breakdown Voltage
VGS=0V, ID=250µA
65
72
-
V
lGSS
Gate-body Leakage Current
VDS=0V, VGS=±20V
-
-
±100
nA
IDSS TJ=25°C
Zero Gate Voltage Drain Current
VDS=65V, VGS=0V
1
μA
IDSS TJ=100°C
100
VGS(th)
Gate-Threshold Voltage
VDS=VGS, ID=250µA
1.2
1.7
2.5
V
RDS(on)
Drain-Source On-Resistance4
VGS=10V, ID=20A
-
7.5
9.0
mΩ
RDS(on)
Drain-Source On-Resistance4
VGS=4.5V, ID=10A
11
13
mΩ
gfs
Forward Transconductance4
VDS = 10V, ID = 10A
-
45
-
S
Ciss
Input Capacitance
VDS=30V, VGS=0V, f =1MHz
-
1210
-
pF
Coss
Output Capacitance
-
343
-
Crss
Reverse Transfer Capacitance
-
17
-
Rg
Gate Resistance
f=1MHz
-
1.5
-
Ω
Qg
Total Gate Charge
VGS=10V, VDS=30V,
ID= 10A
-
21.7
-
nC
Qgs
Gate-Source Charge
-
3.9
-
Qgd
Gate-Drain Charge
-
4.5
-
td(on)
Turn-On Delay Time
VGS=10V, VDD=30V,
RG= 3Ω, ID=10A
-
7.3
-
ns
tr
Rise Time
-
8.5
-
td(off)
Turn-Off Delay Time
-
19.6
-
tf
Fall Time
-
5.6
-
trr
Body Diode Reverse Recovery Time
IF=10A, dl/dt=100A/μs
-
34
-
ns
Qrr
Body Diode Reverse Recovery Charge
-
17
-
nC
VSD
Diode Forward Voltage4
IS=10A, VGS = 0V
-
-
1.2
V
IS
Continuous Source Current
TA=25°C
-
-
65
A
Note
1、The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2、The data tested by pulsed , pulse width
≦ 300us , duty cycle ≦ 2%
3、The EAS data shows Max. rating . The test condition is VDD=25V,VGS=10V,L=0.1mH,IAS=38A
4、The power dissipation is limited by 150
℃ junction temperature
5、The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation



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