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AP80H03GD Datasheet(PDF) 2 Page - A POWER MICROELECTRONICS |
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AP80H03GD Datasheet(HTML) 2 Page - A POWER MICROELECTRONICS |
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2 / 7 page ![]() AP80H03GD 30V N+N-Channel Enhancement Mode MOSFET AP80H03GD RVE1.0 永源微電子科技有限公司 Electrical Characteristics (TJ=25℃, unless otherwise noted) Symbol Parameter Test Condition Min. Typ. Max. Units V(BR)DSS Drain-Source Breakdown Voltage VGS=0V, ID=250μA 30 32 - V △BVDSS/△TJ BVDSS Temperature Coefficient Reference to 25 ℃, ID=1mA --- 0.028 --- V/ ℃ VGS(th) Gate Threshold Voltage VDS= VGS, ID=250μA 1.0 1.6 2.5 V RDS(on) Static Drain-Source on-Resistance note3 VGS =10V, ID =30A - 4.5 5.5 mΩ RDS(on) Static Drain-Source on-Resistance note3 VGS =4.5V, ID =20A - 6.7 9.5 mΩ IDSS Zero Gate Voltage Drain Current VDS =30V, VGS = 0V, - - 1.0 μA IGSS Gate to Body Leakage Current VDS =0V, VGS = ±20V - - ±100 nA Ciss Input Capacitance VDS =15V, VGS =0V, f = 1.0MHz - 2100 - pF Coss Output Capacitance - 326 - pF Crss Reverse Transfer Capacitance - 282 - pF Qg Total Gate Charge VDS =15V, ID =30A, VGS =10V - 45 - nC Qgs Gate-Source Charge - 3 - nC Qgd Gate-Drain(“Miller”) Charge - 15 - nC td(on) Turn-on Delay Time VDS=15V, ID=30A, RGEN=3Ω, VGS =10V - 21 - ns tr Turn-on Rise Time - 32 - ns td(off) Turn-off Delay Time - 59 - ns tf Turn-off Fall Time - 34 - ns IS Maximum Continuous Drain to Source Diode Forward Current - - 90 A ISM Maximum Pulsed Drain to Source Diode Forward Current - - 360 A VSD Drain to Source Diode Forward Voltage VGS = 0V, IS=30A - - 1.2 V trr Body Diode Reverse Recovery Time IF=20A,dI/dt=100A/μs - 15 - ns Qrr Body Diode Reverse Recovery Charge - 4 - nC Note : 1、The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper. 2、The data tested by pulsed , pulse width .The EAS data shows Max. rating . 3、The test cond ≦ 300us , duty cycle ition is VDD=25V,VGS =10V,L=0.1mH,IAS=53.8A 4、The power dissipation is limited by 175 ℃ junction temperature 5、The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation. |
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