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AP80P10NF Datasheet(PDF) 2 Page - A POWER MICROELECTRONICS |
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AP80P10NF Datasheet(HTML) 2 Page - A POWER MICROELECTRONICS |
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2 / 5 page ![]() AP80P10NF -100V P-Channel Enhancement Mode MOSFET AP80P10NF RVE1.0 永源微電子科技有限公司 P-Channel Electrical Characteristics (TJ =25 ℃, unless otherwise noted) Symbol Parameter Test Condition Min. Typ. Max. Units V(BR)DSS Drain-Source Breakdown Voltage VGS=0V, ID=-250μA -100 110 - V IDSS Zero Gate Voltage Drain Current VDS=-100V, VGS=0V, - - -1.0 μA IGSS Gate to Body Leakage Current VDS=0V, VGS= ±20V - - ±100 nA VGS(th) Gate Threshold Voltage VDS=VGS, ID=-250μA -1.0 -1.6 -2.5 V RDS(on) Static Drain-Source on-Resistance VGS=-10V, ID=-20A - 18 25 mΩ VGS=-4.5V, ID=-10A - 21 30 Ciss Input Capacitance VDS=-50V, VGS=0V, f=1.0MHz - 4230 - pF Coss Output Capacitance - 388 - pF Crss Reverse Transfer Capacitance - 26 - pF Qg Total Gate Charge VDS=-50V, ID=-5A, VGS=-10V - 80 - nC Qgs Gate-Source Charge - 15.6 - nC Qgd Gate-Drain(“Miller”) Charge - 17.2 - nC td(on) Turn-on Delay Time VDD=-50V, ID=-5A, RG=6Ω, VGS=-10V - 26 - ns tr Turn-on Rise Time - 78 - ns td(off) Turn-off Delay Time - 200 - ns tf Turn-off Fall Time - 210 - ns IS Maximum Continuous Drain to Source Diode Forward Current - - -80 A ISM Maximum Pulsed Drain to Source Diode Forward Current - - -280 A VSD Drain to Source Diode Forward Voltage VGS=0V, IS=-30A - - -1.2 V trr Body Diode Reverse Recovery Time TJ=25 ℃, IF=-5A,dI/dt=100A/μs - 208 - ns Qrr Body Diode Reverse Recovery Charge - 560 - nC Note : 1、The data tested by surface mounted on a 1 inch 2 FR-4 board with 2OZ copper. 2、The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2% 3、The EAS data shows Max. rating . The test condition is V DD =-72V,VGS =-10V,L=0.1mH,IAS =-50A 4、The power dissipation is limited by 150℃ junction temperature 5、The data is theoretically the same as I D and I DM , in real applications , should be limited by total power dissipation. |
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