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AP100N25MP Datasheet(PDF) 2 Page - A POWER MICROELECTRONICS

Part # AP100N25MP
Description  250V N-Channel Enhancement Mode MOSFET
PDF  7 Pages
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Manufacturer  APME [A POWER MICROELECTRONICS]
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AP100N25MP Datasheet(HTML) 2 Page - A POWER MICROELECTRONICS

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AP100N25MP
250V N-Channel Enhancement Mode MOSFET
AP100N25MP RVE1.0
永源微電子科技有限公司
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max. Units
VDSS
Drain to Source Breakdown Voltage
VGS=0V, ID=250µA
250
275
--
V
IDSS
Drain to Source Leakage Current
VDS=250V, VGS=0V,Ta=25
℃
--
--
1.0
µA
VDS=250V, VGS=0V,Ta=125
℃
--
--
100
IGSS(F)
Gate to Source Forward Leakage
VGS=+20V
--
--
100
nA
IGSS(R)
Gate to Source Reverse Leakage
VGS=-20V
--
--
-100
nA
RDS(ON)
Drain-to-Source On-Resistance
VGS=10V, ID=35A
--
28
33
mΩ
VGS(TH)
Gate Threshold Voltage
VDS=VGS, ID=250µA
3.6
4.5
5.0
V
gfs
Forward Trans conductance
VDS=10V, ID=35A
100
--
--
S
Rg
Gate Resistance
VGS=0V VDS open f=1.0MHz
1.5
Ω
Ciss
Input Capacitance
VGS=0V VDS=25V f=1.0MHz
--
7000
pF
Coss
Output Capacitance
--
480
pF
Crss
Reverse Transfer Capacitance
--
210
pF
td(ON)
Turn-on Delay Time
ID=35A, VDS=50V
VGS=10V, Rg=2.5Ω
--
45
--
ns
tr
Rise Time
--
70
--
ns
td(OFF)
Turn-Off Delay Time
--
110
--
ns
tf
Fall Time
--
90
--
ns
Qg
Total Gate Charge
ID=35A, VDD=100V
VGS=10V
--
200
--
nC
Qgs
Gate to Source Charge
--
28
--
nC
Qgd
Gate to Drain (“Miller”) Charge
--
60
--
nC
ISD
Continuous Source Current (Body Diode)
--
--
58
A
ISM
Maximum Pulsed Current (Body Diode)
--
--
230
A
VSD
Diode Forward Voltage
IS=35A, VGS=0V
--
--
1.2
V
trr
Reverse Recovery Time
IS=30A,Tj=25
℃,VDD=50V
dIF/dt=100A/μs, VGS=0V
--
120
--
ns
Qrr
Reverse Recovery Charge
--
0.55
--
uC
Note :
1、The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2
、The EAS data shows Max. rating . IAS = 35A, RG = 25Ω, VDD=50V,VGS=10V, Starting TJ = 25 ºC
3
、The test condition is Pulse Test: Pulse width ≤ 300μs, Duty Cycle ≤ 1%
4
、The power dissipation is limited by 150℃ junction temperature
5
、The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.



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