RC01 datasheet(10/11 Pages) PHILIPS

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4.18

20 (Ta)

resistance to

soldering heat

unmounted chips; 10 s; 260

±5 °C

no visual

damage

∆R/R max.:

±0.5% +0.05 Ω;

no visual

damage

∆R/R max.:

±1% +0.1 Ω

4.29

45 (Xa)

component

solvent

resistance

isopropyl alcohol or H2O followed

by brushing in accordance with

“MIL 202 F”

no visual damage

4.17

20 (Ta)

solderability

unmounted chips completely

immersed for 2

±0.5 s in a solder

bath at 235

±5 °C

good tinning (

≥95% covered); no visual damage

4.7

voltage proof on

insulation

maximum voltage (RMS) during

1 minute metal block method

no breakdown or ﬂashover

4.13

short time

overload

room temperature; P = 6.25

× P

5 s (V

≤ 2 × Vmax)

∆R/R max.:

±1% +0.05 Ω

∆R/R max.:

±2% +0.1 Ω

4.33

bending

resistors mounted on a 90 mm

glass epoxy resin PCB (FR4),

bending: 3 mm for RC01 and

5 mm for RC11, RC21 and RC31

no visual damage

∆R/R max.: ±1% +0.05 Ω

4.19

14 (Na)

rapid change of

temperature

30 minutes at LCT and

30 minutes at UCT; 5 cycles

no visual

damage

∆R/R max.:

±0.5% +0.05 Ω

no visual

damage

∆R/R max.:

±2% +0.1 Ω

4.23

climatic

sequence:

4.23.3

30 (D)

damp heat

(accelerated)

1st cycle

4.23.6

30 (D)

damp heat

(accelerated)

remaining

cycles

6 days; 55

°C; 95 to 98% RH

Rins min.: 104 MΩ

≤ 1MΩ∆R/R max.:

±1.5% +0.1 Ω

∆R/R max.:

±1% +0.1 Ω

R>1M

Ω∆R/R max.: ±3% +0.1 Ω

not applicable

IEC

115-8

CLAUSE

IEC 68-2

TEST

METHOD

TEST

PROCEDURE

RESISTANCE

RANGE

REQUIREMENTS

RC01

RC11

RC21

RC31

RC01 Datasheet(PDF) 10 Page - NXP Semiconductors

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