DIA1413/1414

Version 1.0, Sep 2024

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© 2024 DIOO MICROCIRCUITS CO., LTD.

III

Table of Contents

1. Pin Assignment and Functions ....................................................................................................................1

2. Absolute Maximum Ratings ........................................................................................................................ 2

3. Recommended Operating Condition .......................................................................................................... 2

4. ESD Ratings ................................................................................................................................................3

5. Thermal Considerations ..............................................................................................................................3

6. Electrical Characteristics .............................................................................................................................3

7. Typical Characteristics ................................................................................................................................ 6

8. Block Diagram .............................................................................................................................................8

9. Function Description ................................................................................................................................... 9

9.1. Operating modes .............................................................................................................................. 9

9.2. External temperature detection ........................................................................................................ 9

9.3. Over-temperature alarm ................................................................................................................... 9

9.4. Open and short faults ..................................................................................................................... 10

9.5. Dynamic averaging ......................................................................................................................... 11

9.6. Conversion rates .............................................................................................................................11

9.7. Reporting temperature .................................................................................................................... 11

9.8. Programming SMBus (or I2C) address........................................................................................... 12

10. Application Information ............................................................................................................................13

11. Communication Protocol and SMBus Protocol .......................................................................................14

11.1. Communication protocol ............................................................................................................... 14

11.2. SMBus protocol .............................................................................................................................15

12. Register Maps ......................................................................................................................................... 17

12.1. Temperature data registers ...........................................................................................................20

12.2. Status register ...............................................................................................................................20

12.3. Configuration register ................................................................................................................... 21

12.4. Conversion rate register ............................................................................................................... 22

12.5. Limit register ................................................................................................................................. 22

12.6. Scratchpad registers .....................................................................................................................24

12.7. One shot register .......................................................................................................................... 24

12.8. Therm Limit registers .................................................................................................................... 25

12.9. External fault register ....................................................................................................................25

12.10. Channel mask register ................................................................................................................26

12.11. Consecutive ALERT register .......................................................................................................26

12.12. Beta configuration registers ........................................................................................................28

12.13. External channel ideality factor registers ....................................................................................29

12.14. High Limit status register ............................................................................................................ 30

12.15. Low Limit status register .............................................................................................................30

12.16. Therm Limit status register ......................................................................................................... 31

12.17. Product ID register ......................................................................................................................32

12.18. Manufacturer ID register .............................................................................................................32

12.19. Revision register ......................................................................................................................... 32

13. Physical Dimensions ...............................................................................................................................33

13.1. MSOP-10 ...................................................................................................................................... 33