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EGA2000-850-UW

Soldering & Storage Information

Datasheet

• PUBLIC

DS000695

• v4-00 • 2023-Apr-04

24

│ 19

9.2

Storage Information

Moisture sensitivity optical characteristics of the device can be adversely affected during the soldering

process by the release and vaporization of moisture that has been previously absorbed into the

package. To ensure the package contains the smallest amount of absorbed moisture possible, each

device is baked prior to being dry packed for shipping. Devices are dry packed in a sealed aluminized

envelope called a moisture-barrier bag with silica gel to protect them from ambient moisture during

shipping, handling, and storage before use.

9.3

Shelf Life

The calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date

code on the bag when stored under the following conditions:

●

Shelf Life: 12 months

●

Ambient Temperature: <40°C

●

Relative Humidity: <90%

Rebaking of the devices will be required if the devices exceed the 12 month shelf life and the Humidity

Indicator Card shows that the devices were exposed to conditions beyond the allowable moisture

region.

9.4

Floor Life

The module has been assigned a moisture sensitivity level of MSL 3. As a result, the floor life of

devices removed from the moisture barrier bag is 168 hours from the time the bag was opened,

provided that the devices are stored under the following conditions:

●

Floor Life: 168 hours

●

Ambient Temperature: <30°C

●

Relative Humidity: <60%

If the floor life or the temperature/humidity conditions have been exceeded, the devices must be

rebaked prior to solder reflow or dry packing.

9.5

Rebaking Instructions

When the shelf life or floor life limits have been exceeded, rebaking is required based on

recommended baking conditions (7h at 105 °C).