0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

Ip(A)

PF(av)(W)

Fig. 1: Power dissipation versus peak forward cur-

rent (triangular waveform,

δ=0.5).

1E-3

1E-2

1E-1

1E+0

1E+1

1E+2

1E+3

1E-3

1E-2

1E-1

1E+0

t(s)

K=[Zth(j-a)/Rth(j-a)]

Single pulse

δ = 0.1

δ = 0.2

δ = 0.5

T

tp

Fig. 2: Relative variation of thermal impedance

junction to ambient versus pulse duration (epoxy

printed circuit board, e(Cu)=35

µm), recommended

pad layout).

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8

1E-2

1E-1

1E+0

1E+1

1E+2

VFM(V)

IFM(A)

Tj=125°C

Tj=25°C

Fig. 3: Forward voltage drop versus forward cur-

rent (maximum values).

0

20

40

60

80

100 120 140 160 180 200

0

50

100

150

200

250

300

350

400

dIF/dt(A/µs)

trr(ns)

IF=Ip

90% confidence

Tj=125°C

Fig. 4: Reverse recovery time versus dIF/dt.

0

20

40

60

80

100 120 140 160 180 200

0

5

10

15

20

VFP(V)

IF=Ip

90% confidence

Tj=125°C

dIF/dt(A/µs)

Fig. 5: Transient peak forward voltage versus

dIF/dt.

0

20

40

60

80

100 120 140 160 180 200

0

50

100

150

200

250

300

350

tfr(ns)

IF=Ip

90% confidence

Tj=125°C

Vfr=1.5V

dIF/dt(A/µs)

Fig. 6: Forward recovery time versus dIF/dt.

MDV04-600

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