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TDA7850 Datasheet(PDF) 14 Page - STMicroelectronics |
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TDA7850 Datasheet(HTML) 14 Page - STMicroelectronics |
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14 / 18 page ![]() Application hints TDA7850 14/18 4 Application hints Ref. to the circuit of Figure 2. 4.1 SVR Besides its contribution to the ripple rejection, the SVR capacitor governs the turn ON/OFF time sequence and, consequently, plays an essential role in the pop optimization during ON/OFF transients. To conveniently serve both needs, Its minimum recommended value is 10µF. 4.2 Input stage The TDA7850's inputs are ground-compatible and can stand very high input signals (± 8Vpk) without any performance degradation. If the standard value for the input capacitors (0.1µF) is adopted, the low frequency cut-off will amount to 16 Hz. 4.3 Stand-by and muting STAND-BY and MUTING facilities are both CMOS compatible. In absence of true CMOS ports or microprocessors, a direct connection to Vs of these two pins is admissible but a 470k Ω equivalent resistance should be present between the power supply and the muting and stand-by pins. R-C cells have always to be used in order to smooth down the transitions for preventing any audible transient noises. About the stand-by, the time constant to be assigned in order to obtain a virtually pop-free transition has to be slower than 2.5V/ms. 4.4 DC offset detector The TDA7850 integrates a DC offset detector to avoid an anomalous DC offset on the inputs of the amplifier which may be multiplied by the gain, and result in a dangerous large offset on the outputs, which may lead to speaker damage through overheating. The feature is enabled by the MUTE pin and works with the amplifier unmuted and with no signal on the inputs. The DC offset detection is signaled out on the HSD pin. 4.5 Heatsink definition Under normal usage (4 Ohm speakers) the heatsink's thermal requirements have to be deduced from Figure 18, which reports the simulated power dissipation when real music/speech programmes are played out. Noise with gaussian-distributed amplitude was employed for this simulation. Based on that, frequent clipping occurrence (worst-case) will cause Pdiss = 26W. Assuming Tamb = 70°C and TCHIP = 150°C as boundary conditions, the heatsink's thermal resistance should be approximately 2°C/W. This would avoid any thermal shutdown occurrence even after long-term and full-volume operation. |
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