LB M673

DATASHEET

DATASHEET

13 | Version 1.7 | 2022-08-03

Recommended Solder Pad 9)

OHLPY978

Paddesign

for improved

heat dissipation

Cu-area > 16 mm

Cu-Fläche > 16 mm

Wärmeableitung

Padgeometrie

für verbesserte

Lötstopplack

Solder resist

0.8 (0.031)

2.8 (0.110)

2

2

2.8 (0.110)

0.8 (0.031)

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not

suitable for ultra sonic cleaning.