Data Sheet

ADRF5715

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 6 of 14

For recommended operating conditions, see Table 1 and Table 2.

Table 3. Absolute Maximum Ratings

Parameter

Rating

VDD

−0.3 V to +3.6 V

VSS

−3.6 V to +0.3 V

Digital Control Inputs

Voltage

−0.3 V to VDD + 0.3 V

Current

3 mA

RF Input Power1

Dual Supply (VDD = +3.3 V, VSS = −3.3 V, f =

100 MHz to 30 GHz, TCASE = 85°C2)

Average

31 dBm

Peak

34 dBm

Hot Switching Average

28 dBm

Hot Switching Peak

31 dBm

Single Supply (VDD = 3.3 V, VSS = 0 V, f = 100

MHz to 30 GHz, TCASE = 85°C2)

Average

19 dBm

Peak

19 dBm

Hot Switching Average

19 dBm

Hot Switching Peak

19 dBm

Unbiased Condition (VDD and VSS = 0 V)

14 dBm

Temperature

Junction (TJ)

135°C

Storage Range

−65°C to +150°C

Reflow

260°C

1 For power derating over frequency, see Figure 2 and Figure 3. Applicable for

all ATTIN and ATTOUT power specifications.

2 For 105°C operation, the power handling degrades from the TCASE = 85°C

specification by 3 dB.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the junction to case bottom (channel to package bottom)

thermal resistance.

Table 4. Thermal Resistance

Package Type

θJC1

Unit

CC-12-6

50

°C/W

1 θJC was determined by simulation under the following conditions: the heat

transfer is due solely to thermal conduction from the channel through the

round pad to the PCB, and the ground pad is held constant at the operating

temperature of 85°C.

POWER DERATING CURVES

Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C

Figure 3. Power Derating vs. Frequency, High Frequency Detail, TCASE = 85°C