Symbol

Parameter

Value

Unit

Junction to leads

20

°C/W

Junction to ambient.

On printed circuit with standard footprint dimensions.

75

°C/W

THERMAL RESISTANCES

Symbol

Parameter

Stand-off voltage

Leakage current at stand-off voltage

ContinuousReverse voltage

Breakdown voltage

Breakover voltage

Holding current

Breakover current

Peak pulse current

C

Capacitance

°C)

Type

Marking

C

max.

max.

note1

max.

note2

max.

min.

note3

typ.

note4

Laser

µAV

µAV

V

mA

mA

pF

SMTPB62

SMTPB68

SMTPB120

SMTPB200

SMTPB270

W07

W11

W21

W31

W43

2

2

2

2

2

56

61

108

180

243

50

50

50

50

50

62

68

120

200

270

82

90

160

267

360

800

800

800

800

800

150

150

150

150

150

160

160

140

130

120

All parameters tested at 25

°C, except where indicated.

Symbol

Parameter

Value

Unit

P

Power dissipation

°C5

W

Peak pulse current

10/1000

µs

8/20

µs

2/10

µs

100

250

500

A

Non repetitive surge peak on-state

current

tp = 20 ms

50

A

dV/dt

Critical rate of rise of off-state voltage

5KV/

µs

Storage temperature range

Maximum junction temperature

- 55 to + 150

+ 150

°C

°C

Maximum lead temperature for soldering during 10 s.

+ 260

°C

°C)

Note 1:

IR measured at VR guarantees VBRmin ≥ VR

Note 2:

Measured at 50 Hz (1 cycle) - See test circuit 1.

Note 3:

See test circuit 2.

Note 4:

VR = 1V, F = 1MHz. Refer to fig 3 for C versus VR.

SMTPBxxx

2/5