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LPC1111FHN33/102 Datasheet(PDF) 3 Page - NXP Semiconductors

Part # LPC1111FHN33/102
Description  microcontroller
PDF  127 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

LPC1111FHN33/102 Datasheet(HTML) 3 Page - NXP Semiconductors

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LPC111X
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 9.2 — 26 March 2014
3 of 127
NXP Semiconductors
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
 LPC1100L series available as TSSOP28 package, DIP28 package, TSSOP20
package, and SO20 package.
 Extended temperature (
40 C to +105 C) for selected parts (see Table 2).
3.
Applications
4.
Ordering information
 eMetering
 Lighting
 Alarm systems
 White goods
Table 1.
Ordering information
Type number
Package
Name
Description
Version
SO20, TSSOP20, TSSOP28, and DIP28 packages
LPC1110FD20
SO20
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
LPC1111FDH20/002
TSSOP20
TSSOP20: plastic thin shrink small outline package; 20 leads; body
width 4.4 mm
SOT360-1
LPC1112FD20/102
SO20
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
LPC1112FDH20/102
TSSOP20
TSSOP20: plastic thin shrink small outline package; 20 leads; body
width 4.4 mm
SOT360-1
LPC1112FDH28/102
TSSOP28
TSSOP28: plastic thin shrink small outline package; 28 leads; body
width 4.4 mm
SOT361-1
LPC1114FDH28/102
TSSOP28
TSSOP28: plastic thin shrink small outline package; 28 leads; body
width 4.4 mm
SOT361-1
LPC1114FN28/102
DIP28
DIP28: plastic dual in-line package; 28 leads (600 mil)
SOT117-1
HVQFN24/33, LQFP48, and TFBGA48 packages
LPC1111FHN33/101
HVQFN33
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
 7  0.85 mm
n/a
LPC1111FHN33/102
HVQFN33
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
 7  0.85 mm
n/a
LPC1111FHN33/201
HVQFN33
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
 7  0.85 mm
n/a
LPC1111FHN33/202
HVQFN33
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
 7  0.85 mm
n/a
LPC1111FHN33/103
HVQFN33
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
 7  0.85 mm
n/a
LPC1111JHN33/103
HVQFN33
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
 7  0.85 mm
n/a
LPC1111FHN33/203
HVQFN33
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
 7  0.85 mm
n/a
LPC1111JHN33/203
HVQFN33
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
 7  0.85 mm
n/a
LPC1112FHN33/101
HVQFN33
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
 7  0.85 mm
n/a
LPC1112FHN33/102
HVQFN33
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7
 7  0.85 mm
n/a



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