TDA7333N datasheet(34/36 Pages) STMICROELECTRONICS

34 / 36 page

Package information

TDA7333N

34/36

Package information

In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®

packages. ECOPACK® packages are lead-free. The category of second Level Interconnect

is marked on the package and on the inner box label, in compliance with JEDEC Standard

JESD97. The maximum ratings related to soldering conditions are also marked on the inner

box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 20.

TSSOP16 mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

1.200

0.047

0.050

0.150

0.002

0.006

0.800

1.000

1.050

0.031

0.039

0.041

0.190

0.300

0.007

0.012

0.090

0.200

0.005

0.009

D (1)

4.900

5.000

5.100

0.114

0.118

0.122

6.200

6.400

6.600

0.244

0.252

0.260

E1 (1)

4.300

4.400

4.500

0.170

0.173

0.177

0.650

0.026

0.450

0.600

0.750

0.018

0.024

0.030

1.000

0.039

0˚ (min.) 8˚ (max.)

aaa

0.100

0.004

Note:

1. D and E1 does not include mold flash or protrusions.

Mold flash or potrusions shall not exceed 0.15mm

(.006inch) per side.

TSSOP16

0080338 (Jedec MO-153-AB)

(Body 4.4mm)

TDA7333N Datasheet(PDF) 34 Page - STMicroelectronics

TDA7333N Datasheet(HTML) 34 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36

Datasheet Download

Link URL