TDA7590 datasheet(38/40 Pages) STMICROELECTRONICS

38 / 40 page

Package information

TDA7590

38/40

9 Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 3.

TQFP144 Mechanical data & package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

1.20

0.047

0.05

0.15

0.002

0.006

0.95

1.00

1.05

0.037

0.039

0.041

0.17

0.22

0.27

0.007

0.009

0.011

0.09

0.20

0.003

0.008

21.80

22.00

22.20

0.858

0.866

0.874

19.80

20.00

20.20

0.779

0.787

0.795

2.00

0.079

17.50

0.689

0.50

0.020

21.80

22.00

22.20

0.858

0.866

0.874

19.80

20.00

20.20

0.779

0.787

0.795

2.00

0.079

17.50

0.689

0.45

0.60

0.75

0.018

0.024

0.030

1.00

0.0393

3.5˚ (min.), 7˚(max.)

ccc

0.08

0.03

TQFP144

(20x20x1.0mm exposed Pad Down)

7386636

Note 1: Exact shape of each corner is optional.

TDA7590 Datasheet(PDF) 38 Page - STMicroelectronics

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