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EMC646SP16JS-70LF Datasheet(PDF) 29 Page - Emerging Memory & Logic Solutions Inc

Part # EMC646SP16JS-70LF
Description  4Mx16 bit CellularRAM
PDF  65 Pages
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Manufacturer  EMLSI [Emerging Memory & Logic Solutions Inc]
Direct Link  http://www.emlsi.com
Logo EMLSI - Emerging Memory & Logic Solutions Inc

EMC646SP16JS-70LF Datasheet(HTML) 29 Page - Emerging Memory & Logic Solutions Inc

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EMC646SP16J
4Mx16 CellularRAM
29
Preliminary
Electrical Characteristics
Table 9: Absolute Maximum Ratings
Stresses greater than those listed may cause permanent damage to the device.
This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Table 10: Electrical Characteristics and Operating Conditions
Wireless Temperature (-30°C < TC < +85°C)
Note:
1. Input signals may overshoot to VccQ + 1.0V for periods less than 2ns during transitions.
2. Input signals may undershoot to Vss - 1.0V for periods less than 2ns during transitions.
3. BCR[5:4] = 01b (default setting of one-half drive strength).
4. This parameter is specified with the outputs disabled to avoid external loading effects. The user must add the current required to drive output
capacitance expected in the actual system.
5. ISB (max) values measured with PAR set to FULL ARRAY and at +85°C. In order to achieve low standby current, all inputs must be driven to
either VccQ or Vss. ISB might be slightly higher for up to 500ms after power-up, or when entering standby mode.
6. ISB (typ) is the average ISB at 25°C and Vcc = VccQ = 1.8V. This parameter is verified during characterization, and is not 100% tested.
Parameter
Rating
Voltage to any pin except Vcc, VccQ relative to Vss
-0.30V to VccQ + 0.3V
Voltage on Vcc supply relative to Vss
-0.2V to +2.45V
Voltage on VccQ supply relative to Vss
-0.2V to +2.45V
Storage temperature (plastic)
-55°C to +150°C
Operating temperature (case) Wireless
-30°C to +85°C
Soldering temperature and time 10s (solder ball only)
+260°C
Description
Conditions
Symbol
Min
Max
Unit
Note
Supply voltage
Vcc
1.7
1.95
V
I/O supply voltage
VccQ
1.7
1.95
V
Input high voltage
VIH
VccQ - 0.4
VccQ + 0.2
V
1
Input low voltage
VIL
-0.20
0.4
V
2
Output high voltage
IOH = -0.2mA
VOH
0.80 VccQ
V
3
Output low voltage
IOL = +0.2mA
VOL
0.20 VccQ
V
3
Input leakage current
VIN = 0 to VccQ
ILI
1
µA
Output leakage current
OE# = VIH or chip disabled
ILO
1
µA
Operating current
Conditions
Symbol
Typ
Max
Unit
Note
Asynchronous random
READ/WRITE
VIN = VccQ or 0V chip enabled, IOUT = 0
ICC1
70ns
25
mA
4
Asynchronous
PAGE READ
ICC1P
70ns
18
mA
4
Initial access
burst READ/WRITE
ICC2
104MHz
35
mA
4
83MHz
30
mA
66MHz
25
mA
Continuous burst READ
ICC3R
104MHz
30
mA
4
83MHz
25
mA
66MHz
20
mA
Continuous burst WRITE
ICC3W
104MHz
35
mA
4
83MHz
30
mA
66MHz
25
mA
Standby current
VIN = VccQ or 0V, CE# = VccQ
ISB
Standard
50
180
µA
5, 6
Low Power
160
µA
LowLowPower
140
µA



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