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STB6NB50 Datasheet(PDF) 1 Page - STMicroelectronics

Part # STB6NB50
Description  N - CHANNEL 500V - 1.35ohm - 5.8A - D2PAK/I2PAK PowerMESH MOSFET
PDF  9 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STB6NB50 Datasheet(HTML) 1 Page - STMicroelectronics

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STB6NB50
N - CHANNEL 500V - 1.35
Ω - 5.8A - D2PAK/I2PAK
PowerMESH
™ MOSFET
s
TYPICAL RDS(on) = 1.35
Ω
s
EXTREMELY HIGH dv/dt CAPABILITY
s
100% AVALANCHE TESTED
s
VERY LOW INTRINSIC CAPACITANCES
s
GATE CHARGE MINIMIZED
DESCRIPTION
Using the latest high voltage MESH OVERLAY
™
process, STMicroelectronics has designed an
advanced family
of
power MOSFETs
with
outstanding performances.
The
new
patent
pending strip layout coupled with the Company’s
proprietary edge termination structure, gives the
lowest RDS(on) per area, exceptional avalanche
and dv/dt capabilities and unrivalled gate charge
and switching characteristics.
APPLICATIONS
s
HIGH CURRENT, HIGH SPEED SWITCHING
s
SWITCH MODE POWER SUPPLIES (SMPS)
s
DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES AND MOTOR DRIVE
®
INTERNAL SCHEMATIC DIAGRAM
November 1999
TYPE
VDSS
RDS(on)
ID
ST B6NB50
500 V
< 1.5
Ω
5.8 A
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Un it
VDS
Drain-source Voltage (VGS =0)
500
V
VDGR
Drain- gate Volt age (RGS =20 k
Ω)
500
V
VGS
G ate-source Voltage
± 30
V
ID
Drain Current (continuous) at Tc =25
oC5.8
A
ID
Drain Current (continuous) at Tc =100
oC3.7
A
IDM (
•)
Drain Current (pulsed)
23.2
A
Ptot
T otal Dissipation at Tc =25
oC100
W
Derating Factor
0.8
W /
o C
dv/dt (1)
Peak Diode Recovery volt age slope
4.5
V/ns
Tstg
Storage Temperat ure
-65 to 150
o C
Tj
Max. Operating Junction Temperature
150
o C
(
•) Pulse width limited by safe operating area
( 1)ISD
≤ 6A, di/dt ≤ 200 A/µs, VDD ≤ V(BR)DSS,Tj ≤ TJMAX
1
2 3
I
2PAK
TO-262
(suffix ”-1”)
1
3
D
2PAK
TO-263
(Suffix ”T4”)
1/9


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