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STB9NB60 Datasheet(PDF) 1 Page - STMicroelectronics

Part # STB9NB60
Description  N - CHANNEL 600V - 0.7ohm - 9A - I2PAK/D2PAK PowerMESH MOSFET
PDF  9 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STB9NB60 Datasheet(HTML) 1 Page - STMicroelectronics

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STB9NB60
N - CHANNEL 600V - 0.7
Ω -9A - I2PAK/D2PAK
PowerMESH
™ MOSFET
s
TYPICAL RDS(on) = 0.7
Ω
s
EXTREMELY HIGH dv/dt CAPABILITY
s
100% AVALANCHE TESTED
s
VERY LOW INTRINSIC CAPACITANCES
s
GATE CHARGE MINIMIZED
DESCRIPTION
Using the latest high voltage MESH OVERLAY
™
process, STMicroelectronics has designed an
advanced family
of
power MOSFETs with
outstanding performances. The
new
patent
pending strip layout coupled with the Company’s
proprietary edge termination structure, gives the
lowest RDS(on) per area, exceptional avalanche
and dv/dt capabilities and unrivalled gate charge
and switching characteristics.
APPLICATIONS
s
HIGH CURRENT, HIGH SPEED SWITCHING
s
SWITCH MODE POWER SUPPLIES (SMPS)
s
DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES AND MOTOR DRIVE
®
INTERNAL SCHEMATIC DIAGRAM
January 2000
1
2 3
I
2PAK
TO-262
(suffix ”-1”)
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Un it
VDS
Drain-source Voltage (VGS = 0)
600
V
VDGR
Drain- gate Voltage (RGS =20 k
Ω)
600
V
VGS
G ate-source Volt age
± 30
V
ID
Drain Current (continuous) at Tc =25
oC9
A
ID
Drain Current (continuous) at Tc =100
oC5.7
A
IDM (
•)
Drain Current (pulsed)
36
A
Ptot
T otal Dissipat ion at Tc =25
oC
125
W
Derating Factor
1
W /
o C
dv/dt (1)
Peak Diode Recovery voltage slope
4.5
V/ns
Tstg
Storage Temperature
-65 to 150
o C
Tj
Max. Operating Junction Temperature
150
o C
(
•) Pulse width limited by safe operating area
( 1)ISD
≤ 9A, di/dt ≤ 200 A/µs, VDD ≤ V(BR)DSS,Tj ≤ TJMAX
TYPE
VDSS
RDS(on)
ID
ST B9NB60
600 V
< 0.8
Ω
9A
1
3
D
2PAK
TO-263
(Suffix ”T4”)
1/8


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