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AM29F400B Datasheet(PDF) 42 Page - Advanced Micro Devices |
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AM29F400B Datasheet(HTML) 42 Page - Advanced Micro Devices |
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42 / 42 page ![]() Am29F400B 41 General Description Third paragraph: Added 45 ns to access times. Product Selector Guide Added the -45 speed option for VCC = 5.0 V ± 5% and the -55 speed option for VCC = 5.0 V ± 10%. Ordering Information Added “Special Designation” to “Optional Processing” heading; added “0” for 55 ns 10% VCC, deleted burn-in. Burn-in is available by contacting an AMD representative. Added -55 ± 10% and -45 speed options to the list of valid combinations. Added extended temperature ratings to -55 ±5% valid combinations. Table 1, Device Bus Operations Changed the BYTE#=VIL input for DQ8–DQ15 during temporary sector unprotect to “don’t care” (X). Figure 6. Maximum Negative Undershoot Waveform Corrected figure title. Table 7, Test Specifications Test load capacitance: Removed 55 ns speed option from and added -45 speed option to the 30 pF. DC Characteristics Removed VCC = VCC max test condition for ICC1 – ICC3. VCC max is only valid for max specs. AC Characteristics Added the -45 speed option. Revision C+4 (August 1998) Ordering Information Added extended temperature combinations to the -55, ±10% speed option. Deleted the -60 speed option. Revision D (January 1999) Distinctive Characteristics Added: s 20-year data retention at 125 °C — Reliable operation for the life of the system DC Characteristics—TTL/NMOS Compatible ICC1, ICC2, ICC3: Added Note 2 “Maximum ICC specifications are tested with VCC = VCCmax”. DC Characteristics—CMOS Compatible ICC1, ICC2, ICC3: Added Note 2 “Maximum ICC specifications are tested with VCC = VCCmax”. Erase and Programming Performance Deleted “(4.75 V for -45 and -55xx0)” from Note 2. Revision D+1 (July 2, 1999) Global Added references to availability of device in Known Good Die (KGD) form. Revision E (November 15, 1999) AC Characteristics—Figure 13. Program Operations Timing and Figure 14. Chip/Sector Erase Operations Deleted tGHWL and changed OE# waveform to start at high. Physical Dimensions Replaced figures with more detailed illustrations. Revision E+1 (November 30, 2000) Added table of contents. Reinserted revision summa- ries for revisions A and B. Trademarks Copyright © 2000 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc. ExpressFlash ™ is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are for identification purposes only and may be trademarks of their respective companies. |
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