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STPAC01F1 Datasheet(PDF) 5 Page - STMicroelectronics |
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STPAC01F1 Datasheet(HTML) 5 Page - STMicroelectronics |
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5 / 6 page ![]() STPAC01F1 5/6 1.57mm ± 50µm 315µm ± 50 500µm ± 50 650µm ± 65 PACKAGE MECHANICAL DATA 365 240 x y x w x w Dot, ST logo xxx = marking yww = datecode (y = year ww = week) All dimensions in µm MARKING Copper pad Diameter : 250µm recommended , 300µm max Solder stencil opening : 330µm Solder mask opening recommendation : 340µm min for 300µm copper pad diameter FOOT PRINT RECOMMENDATIONS |
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