M24128-BFMB3TG datasheet(29/39 Pages) STMICROELECTRONICS

29 / 39 page

M24128, M24C64, M24C32

Package mechanical data

29/39

Package mechanical data

In order to meet environmental requirements, ST offers the M24C32, M24C64 and M24128

in ECOPACK® packages. These packages have a lead-free second level interconnect. The

category of second level interconnect is marked on the package and on the inner box label,

in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at www.st.com.

Figure 14.

PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline

Drawing is not to scale.

Table 19.

PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package mechanical data

Symbol

millimeters

inches(1)

Values in inches are converted from mm and rounded to 4 decimal digits.

Typ.

Min.

Max.

Typ.

Min.

Max.

5.33

0.2098

0.38

0.0150

3.30

2.92

4.95

0.1299

0.1150

0.1949

0.46

0.36

0.56

0.0181

0.0142

0.0220

1.52

1.14

1.78

0.0598

0.0449

0.0701

0.25

0.20

0.36

0.0098

0.0079

0.0142

9.27

9.02

10.16

0.3650

0.3551

0.4000

7.87

7.62

8.26

0.3098

0.3000

0.3252

6.35

6.10

7.11

0.2500

0.2402

0.2799

e2.54

–

0.1000

–

7.62

–

0.3000

–

10.92

0.4299

3.30

2.92

3.81

0.1299

0.1150

0.1500

PDIP-B

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