Rev. 2.6

Page 2

2007-08-30

SPP06N80C3

SPA06N80C3

Maximum Ratings

Parameter

Symbol

Value

Unit

Drain Source voltage slope

dv/dt

50

V/ns

Thermal Characteristics

Parameter

Symbol

Values

Unit

min.

typ.

max.

Thermal resistance, junction - case

-

-

1.5

K/W

Thermal resistance, junction - case, FullPAK

-

-

3.9

Thermal resistance, junction - ambient, leaded

-

-

62

Thermal resistance, junction - ambient, FullPAK

-

-

80

Soldering temperature, wavesoldering

-

-

260

°C

Electrical Characteristics, at Tj=25°C unless otherwise specified

Parameter

Symbol

Conditions

Values

Unit

min.

typ.

max.

800

-

-

V

Drain-Source avalanche

breakdown voltage

-

870

-

Gate threshold voltage

2.1

3

3.9

Zero gate voltage drain current

-

-

0.5

-

10

100

µA

Gate-source leakage current

-

-

100

nA

-

-

0.78

2.1

0.9

-

Ω

Gate input resistance

f=1MHz, open drain

-

0.7

-