NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 4

03.07.2008

FERRITE CHIP BEADS

Z3 SERIES

8. RELIABILITY & TEST CONDITION :

40(1.575)

100(3.937)

60

seconds

10±0.5

seconds

The terminal electrode & the dielectric must

not be damaged by the forces applied on the

Bending

The terminal electrode & the dielectric must

not be damaged by the forces applied on the

W

Flexture Strength

45(1.772)

right conditions.

20(.787)

45(1.772)

W

Terminal Strength

Solderability

4±1.0

seconds

150°C

60

seconds

right conditions.

Preheating

should be covered with solder.

More than 90% of the terminal electrode

245°C

Dipping

cooling

Natural

0.6

3

Solder a chip on a test substrate, bend the substrate

by 2mm (0.079in) and return.

8

7

2.0

1.5

6

5

4

1.0

1.0

1.0

> 25

Force (Kfg)

2

1

Size

0.5

0.2

For Z Series :

Time (sec)

Solder Temperature : 245±5°C

Preheat : 150°C, 60sec.

Dip Time : 4±1sec.

Flux for lead free : rosin

Solder : Sn-Ag3.0-Cu0.5

Refer to standard electrical characteristics list

Electrical Characteristics Test

Solder Heat Resistance

Temperature Rise Test

Rated Current

DC Resistance

Impedance

Preheating

Appearance : No significant abnormality

Impedance change : Within ±30%

150°C

260°C

Dipping

Natural

cooling

30°C max. ( t)

ITEM

PERFORMANCE

2. Temperature measured by digital surface thermometer.

Flux for lead free : rosin

Preheat : 150°C, 60sec.

Solder : Sn-Ag3.0-Cu0.5

Solder Temperature : 260±5°C

Dip Time : 10±0.5sec.

1. Applied the allowed DC current.

HP4291A, HP4287A+16092A

HP4338B

TEST CONDITION