TL081, TL081A, TL081B, TL082, TL082A, TL082B

TL082Y, TL084, TL084A, TL084B, TL084Y

JFET-INPUT OPERATIONAL AMPLIFIERS

SLOS081E – FEBRUARY 1977 – REVISED FEBRUARY 1999

6

POST OFFICE BOX 655303

TL084Y chip information

These chips, when properly assembled, display characteristics similar to the TL084. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive

epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (11) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

+

–

1OUT

1IN +

1IN –

VCC+

(4)

(6)

(3)

(2)

(5)

(1)

–

+

(7)

2IN +

2IN –

2OUT

(11)

VCC –

+

–

3OUT

3IN +

3IN –

(13)

(10)

(9)

(12)

(8)

–

+

(14)

4OUT

4IN +

4IN –

105

62

(13)

(12)

(11)

(10)

(9)

(8)

(7)

(6)

(4)

(3)

(2)

(1)

(14)