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ASM3P2508AF-08ST Datasheet(PDF) 2 Page - PulseCore Semiconductor

Part # ASM3P2508AF-08ST
Description  Peak EMI Reducing Solution
PDF  9 Pages
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Manufacturer  PULSECORE [PulseCore Semiconductor]
Direct Link  http://www.onsemi.com/
Logo PULSECORE - PulseCore Semiconductor

ASM3P2508AF-08ST Datasheet(HTML) 2 Page - PulseCore Semiconductor

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Peak EMI Reducing Solution
2 of 9
February 2007
ASM3P2508A
rev 1.4
Notice: The information in this document is subject to change without notice.
Pin Configuration
Pin Description
Pin Name
Type
Description
XIN
I
Connection to crystal
XOUT
O
Connection to crystal
VDD
P
Power supply for the analog and digital blocks
FOUT1CLK
O
Clock output-1 (120MHz) - default
FOUT2CLK
O
Clock output-2 ( 72MHz / 48MHz)
SDA
I/O
I2C Data
SCL
I
I2C Clock
VSS
P
Ground to entire chip
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
VDD, VIN
Voltage on any pin with respect to Ground
-0.5 to +4.6
V
TSTG
Storage temperature
-40 to +85
°C
TA
Operating temperature
0 to 70
°C
Ts
Max. Soldering Temperature (10 sec)
260
°C
TJ
Junction Temperature
150
°C
TDV
Static Discharge Voltage
(As per JEDEC STD22- A114-B)
2
KV
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.
Operating Conditions
Symbol
Parameter
Condition /
Description
Min
Typ
Max
Unit
VDD
Supply Voltage
3.3V ± 10%
3
3.3
3.6
V
TA
Ambient Operating Temperature Range
-10
+70
°C
FXIN
Crystal Resonator Frequency
14.31818
MHz
Serial Data Transfer Rate
Standard Mode
10
100
Kb/s
CL
Output Driver Load Capacitance
15
pF
VDD
FOUT1CLK
8
7
6
5
FOUT2CLK
SDA
SCL
VSS
XOUT
1
2
3
4
XIN
ASM3P2508A



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