XC6216 datasheet(39/43 Pages) TOREX

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XC6216/XE6216

Series

●

USP-6C Power Dissipation

て

Board Mount (Tj max = 125℃)

Ambient Temperature（℃）

Power Dissipation Pd（mW）

Thermal Resistance (℃/W)

1000

400

100.00

Pd-Ta特性グラフ

200

400

600

800

1000

1200

105

125

周辺温度Ta（℃）

Power dissipation data for the USP-6C is shown in this page.

The value of power dissipation varies with the mount board conditions.

Please use this data as one of reference data taken in the described condition.

Measurement Condition (Reference data)

Condition:

Mount on a board

Ambient:

Natural convection

Soldering:

Lead (Pb) free

Board:

Dimensions 40 x 40 mm (1600 mm

2 in one side)

Copper (Cu) traces occupy 50% of the board area

In top and back faces

Package heat-sink is tied to the copper traces

Material:

Glass Epoxy (FR-4)

Thickness:

1.6 mm

Through-hole:

4 x 0.8 Diameter

Evaluation Board (Unit: mm)

2. Power Dissipation vs. Operating temperature

Pd vs. Ta

Ambient Temperature Ta (℃)

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PACKAGING INFORMATION (Continued)

XC6216 Datasheet(PDF) 39 Page - Torex Semiconductor

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